Academic Internship in Mechanical Engineering (f/m/div.)

Company Description

The Bosch Group has more than 400 000 employees around the world, present in 60 countries, and we are proud to impact people's lives and to work towards a more sustainable future.

Bosch Car Multimedia, S.A. belongs to the Automotive Electronics division and is focused on making the vehicles our third living space. About 3.600 associates are committed to develop and produce high quality technology that shape change in mobility worldwide. The company' success lies in its highly specialized and innovative team, and on the technological know-how which makes Bosch the leading supplier in the automotive market.

At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people's lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in and feel the difference in mindsets, cultures, generations, identities and perspectives. Everyone should bring their authenticity and work together respectfully. Bosch is an employer that values diversity and equal opportunities. We welcome applications from people with disabilities and we can provide reasonable accommodations during the recruitment process and in the performance of professional activity. By including everyone and ensuring equal opportunities we unleash our full potential.

Job Description

Your contribution to something big

• Project Background:

1. One of the first steps in obtaining an electronics product is correct design and manufacturing of Printed Circuit Boards assemblies (PCBa). This is where our section is positioned, in developing the technologies thar allow us to manufacture PCB Assemblies.
2. In a fast moving and highly competitive market, being fast and efficient is the answer. Simulation plays a big role in today's industry. By creating digital twins for manufacturing processes we shoot for that effectiveness. These are based on simulation models for each process with inputs closely replicating machine parameters and raw material geometry and physical properties. As for outputs they allow to forecast the quality and probability of defects on a given PCBa. The more accurate the inputs and simulation strategy the higher is the quality outcome of the simulation. This project aims on increasing model accuracy by investigating both material properties and simulation strategies.

• Research Objectives:

1. Understand the physical phenomena behind reflow soldering process;
2. Research and characterize relevant material properties;
3. Investigate state of the art simulation methodologies;
4. Simulation Model Development/Improvement;
5. Implement automation strategies for simulation models (Python Based);

• Proposed Study Plan:

1. Literature Review;
2. Productive Processes familiarization physical characterization;
3. Material Characterization (experimental and analytical);
4. Familiarization and on-the-job training with simulation software (Ansys);
5. Simulation Model Development;
6. Simulation Model Validation;
7. Discussion & Thesis Writing.

Qualifications

What distinguishes you

- Desired Competencies and Profile:

   •    Advanced Knowledge Fluid Mechanics and Strength of Materials;

   •    Prior Contact with Finite Element Methods and/or Computational Fluid Dynamics;

   •    Python knowledge;

   •    Experimental Design and Data Analysis: Basic knowledge of experimental planning and data analysis, including statistical treatment, with interest in strengthening these skills through practical application;

   •    Problem-Solving and Critical Thinking: Analytical mindset with the ability to approach complex physical phenomena in a structured manner and develop technically sound solutions;

   •    Fluent in English (written, verbal, technical communication;

   •    Good presentation skills;

   •    Team Work.